Heating and reliability characteristics of electrically conductive adhesives using variable frequency microwave cure

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn 2000-January, Issue , 2000, Pages 373-377

  Wang, Tiebing ^a   Fu, Ying ^a   Becker, M ^b   Liu, J ^a  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b Macrotron Process Technologies GmbH   (Germany)

Author keywords

Conducting materials; Conductive adhesives; Curing; Electromagnetic heating; Frequency; Inorganic materials; Microwave theory and techniques; Polymers; Resistance heating; Shape

Indexed keywords

ADHESIVE JOINTS; ADHESIVES; CURING; ELECTRONICS PACKAGING; HEATING; METALS; MICROWAVES; POLYMERS; RELIABILITY;

CONDUCTING MATERIALS; CONDUCTIVE ADHESIVE; ELECTROMAGNETIC HEATING; FREQUENCY; INORGANIC MATERIALS; MICROWAVE THEORY AND TECHNIQUES; RESISTANCE-HEATING; SHAPE;

CONDUCTIVE MATERIALS;

EID: 0012040409     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2000.906403     Document Type: Conference Paper

References (11)

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10. st ECTC Conference, May 30-June, 2, 2001, Orlando, Florida, USA
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