High frequency longitudinal-transverse complex vibration systems for ultrasonic wire bonding

Proceedings of the IEEE Ultrasonics Symposium

Volumn 1, Issue , 1997, Pages 849-854

  Tsujino, Jiromaru ^a   Yoshihara, Hiroyuki ^a   Kamimoto, Kazuyoshi ^a   Osada, Yoshiaki ^a  

^a KANAGAWA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; LSI CIRCUITS; VIBRATION MEASUREMENT; WIRE;

ULTRASONIC WIRE BONDING;

ULTRASONIC WELDING;

EID: 0031345453     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)