Copper metalization using electroplating process

International Journal of Modern Physics B

Volumn 17, Issue 8-9 I, 2003, Pages 1261-1266

  Park, Byung Nam ^a   Choi, Sie Young ^a  

^a Kyungpook National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; COPPER SULFATE;

AUGER ELECTRON SPECTROSCOPY; CONFERENCE PAPER; COST; CRYSTAL; ELECTRIC RESISTANCE; ELECTRICITY; ELECTRODE; ELECTROPLATING INDUSTRY; MAGNETIC FIELD; OXIDATION; PULSE GENERATOR; SAFETY; SCANNING ELECTRON MICROSCOPY; TEMPERATURE; WET DEPOSITION; X RAY DIFFRACTION;

EID: 0037763898     PISSN: 02179792     EISSN: None     Source Type: Journal    
DOI: 10.1142/s0217979203018843     Document Type: Conference Paper

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