A novel thick photoresist for microsystem technology

Microelectronic Engineering

Volumn 67-68, Issue , 2003, Pages 259-265

  Niedermann, Ph ^a   Berthou, H ^a   Zwickl, S ^b   Schonholzer U ^b   Meier, K ^c   Gantner, Ch ^c   Kapp Schwoerer, D ^c  

^a CSEM   (Switzerland)

^b Elmicron AG   (Switzerland)

^c HTP HiTech Photopolymere AG   (Switzerland)

Author keywords

Acrylic photoresist; Electroforming; MEMS; Microsystems; Molding; Photolithography; Thick photoresist

Indexed keywords

ELECTROFORMING; MICROELECTROMECHANICAL DEVICES; MOLDING; SPIN COATING;

MICROSYSTEMS;

PHOTORESISTS;

EID: 0037683098     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(03)00185-0     Document Type: Conference Paper

References (4)

1. Lorenz H., Despont M., Fahrni N., Brugger J., Vettiger P., Renaud P. High-aspect-ratio, ultrathick, negative-tone near-UV photoresist and its applications for MEMS. Sensors Actuators. A64:1998;33-39.
2. Bischofberger R., Zimmermann H., Staufert G. Low-cost HARMS process. Sensors Actuators. A61:1997;392-399.
3. EKC Technology, Inc., Danville, California, USA.
4. Model K202, RK Print Coat Industries, UK, www.rkprint.com.