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Volumn 9, Issue 5, 2003, Pages 304-307

Application oriented complex polymer microoptics

Author keywords

[No Author keywords available]

Indexed keywords

LASER BEAM EFFECTS; MICROLENSES; OPTICAL DEVICES; OPTOELECTRONIC DEVICES; REFRACTIVE INDEX;

EID: 0037670652     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-002-0234-2     Document Type: Article
Times cited : (7)

References (5)
  • 1
    • 0037691107 scopus 로고
    • Replication of waveguide elements using ORMOCERE material
    • In: Reichl H, Heuberger A (eds); VDE-Verlag
    • Dannberg P; Braeuer A; Karthe W; Waldhäusl R; Wolter H (1994) Replication of waveguide elements using ORMOCERE material. In: Reichl H, Heuberger A (eds), Microsystem Technologies '94, VDE-Verlag, pp. 281-287
    • (1994) Microsystem Technologies '94 , pp. 281-287
    • Dannberg, P.1    Braeuer, A.2    Karthe, W.3    Waldhäusl, R.4    Wolter, H.5
  • 2
    • 0000610014 scopus 로고
    • Microlenses fabricated by melting a photoresist on a base layer
    • Haselbeck S; Schreiber H; Schwider J; Streibl N (1993) Microlenses fabricated by melting a photoresist on a base layer. Opt Eng 32: 1322
    • (1993) Opt Eng , vol.32 , pp. 1322
    • Haselbeck, S.1    Schreiber, H.2    Schwider, J.3    Streibl, N.4
  • 3
    • 0141783230 scopus 로고    scopus 로고
    • Technique for monolithic fabrication of silicon microlenses with selectable rim angles
    • Erdmann L; Efferenn D (1997) Technique for monolithic fabrication of silicon microlenses with selectable rim angles. Opt Eng 36: 1094
    • (1997) Opt Eng , vol.36 , pp. 1094
    • Erdmann, L.1    Efferenn, D.2
  • 4
    • 0032069485 scopus 로고    scopus 로고
    • Microsystems and wafer processesfor volume production of highly reliable fiber optic components for Telecom and Datacom applications
    • Althaus HL; Gramann W; Panzer K (1998) Microsystems and wafer processesfor volume production of highly reliable fiber optic components for Telecom and Datacom applications. IEEE Trans Components, Packaging, and Manufacturing Technology - Part B 21: 147-156
    • (1998) IEEE Trans Components, Packaging, and Manufacturing Technology - Part B , vol.21 , pp. 147-156
    • Althaus, H.L.1    Gramann, W.2    Panzer, K.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.