Pb/In solder bump formation for a flip-chip bonding technique at high speed optical communication devices

IEEE Asia-Pacific Conference on Circuits and Systems - Proceedings

Volumn , Issue , 1996, Pages 421-424

  Han, Haksoo ^a   Chung, Hyunsoo ^a   Park, Sungkook ^a   Joe, Yungil ^a   Park, Sungsoo ^a   Joo, Gwanchong ^a   Hwang, Nam ^a   Lee, Hee Tae ^a   Seungoo, Kang ^a   Min Kyu, Song ^a  

^a Yonsei University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; DEPOSITION; FLIP CHIP DEVICES; INDIUM; LEAD ALLOYS; OPTICAL COMMUNICATION EQUIPMENT; PHOTORESISTS; SOLDERING ALLOYS;

FLIP CHIP BONDING INTERCONNECTION; SOLDER BUMP; THERMAL EVAPORATION;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0030392935     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)