ORMOCERsTM-new photo-patternable dielectric and optical materials for MCM-packaging

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 1018-1025

  Popall, M ^a   Dabek, A ^b   Robertsson, M E ^c   Gustafsson, G ^d   Hagel, O J ^d   Olsowski, B ^a   Buestrich, R ^a   Cergel, L ^e   Lebby, M ^e   Kiely, P ^e   Joly, J ^f   Lambert, D ^f   Schaub, M ^g   Reichl, H ^b  

^a Fraunhofer Institut Her Silicatforschung   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^c ERICSSON RADIO SYSTEMS AB   (Sweden)

^d IMC   (Sweden)

^e MOTOROLA INC   (United States)

^f VLSI Packaging   (France)

^g WC Heraeus GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION PROGRAMS; DIELECTRIC MATERIALS; NETWORK COMPONENTS; PACKAGING MATERIALS; PASSIVATION; SOFTWARE TESTING; SOL-GEL PROCESS; CROSSLINKING; ELECTRIC LOSSES; INORGANIC POLYMERS; MATERIALS TESTING; MULTICHIP MODULES; NEGATIVE RESISTANCE; OPTICAL MATERIALS; ORGANIC POLYMERS; PERMITTIVITY; REFRACTIVE INDEX; SOL-GELS;

HIGH INTEGRATION LEVEL; HYBRID INORGANIC-ORGANIC; MICRO-SYSTEM TECHNOLOGIES; MODERATE TEMPERATURE; OPTICAL APPLICATIONS; ORGANOSILANE PRECURSORS; SYSTEMATIC VARIATION; THIN-FILM TECHNOLOGY;

ORGANIC POLYMERS; ELECTRONICS PACKAGING;

HYBRID INORGANIC ORGANIC POLYMERS;

EID: 0031620187     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678838     Document Type: Conference Paper

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