Raman spectroscopy as a stress sensor in packaging: Correct formulae for different sample surfaces

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1310-1317

  Chen, Jian ^a   De Wolf, Ingrid ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

STRESS SENSOR; THERMO-MECHANICAL STRESS;

COPPER; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MICROPROCESSOR CHIPS; RAMAN SPECTROSCOPY; SEMICONDUCTING SILICON; SENSORS; STRESSES; TENSORS;

ELECTRONICS PACKAGING;

EID: 0036297074     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2002.1008275     Document Type: Conference Paper

References (11)

1. Raman scattering in Si and germanium
2. Light scattering in semiconductors
3. Local stress analysis on polymer stud grid array (PSGA) packages by raman spectroscopy and FEM simulation