Development of low loop, long length, hydrostatically extruded bonding wire

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 1997, Pages 120-123

  Lichtenberger, Heiner ^a   Toea, Gabriel ^a   Zasowski, Michael ^a  

^a Williams Advanced Materials   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC WIRE; EXTRUSION; GOLD; MICROELECTRONICS; STRENGTH OF MATERIALS; TEMPERATURE;

BONDING WIRE; GOLD WIRE; HYDROSTATIC EXTRUSION;

ELECTRONICS PACKAGING;

EID: 0030672494     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (4)