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Volumn 15, Issue 2, 2003, Pages 245-247

Laterally actuated torsional micromirrors for large static deflection

Author keywords

Comb drive; High aspect ratio; MEMS; Microfabrication; Micromachining; Micromirror; MOEMS; Optical MEMS; Static deflection

Indexed keywords

ASPECT RATIO; ELECTROSTATIC ACTUATORS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; NATURAL FREQUENCIES; SILICON ON INSULATOR TECHNOLOGY;

EID: 0037320894     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/LPT.2002.806085     Document Type: Article
Times cited : (45)

References (10)
  • 1
    • 0000643961 scopus 로고    scopus 로고
    • Free-space integrated optics realized by surface-micromachining
    • M. C. Wu, L. Y. Lin, S. S. Lee, and C. R. King, "Free-space integrated optics realized by surface-micromachining," Int. J. High Speed Electron. Syst., vol. 8, no. 2, pp. 283-297, 1997.
    • (1997) Int. J. High Speed Electron. Syst. , vol.8 , Issue.2 , pp. 283-297
    • Wu, M.C.1    Lin, L.Y.2    Lee, S.S.3    King, C.R.4
  • 5
    • 0032653423 scopus 로고    scopus 로고
    • Wavelength add-drop switching using tilting micromirrors
    • May
    • J. E. Ford, V. A. Aksyuk, D. J. Bishop, and J. A. Walker, "Wavelength add-drop switching using tilting micromirrors," J. Lightwave Technol., vol. 17, pp. 904-911, May 1999.
    • (1999) J. Lightwave Technol. , vol.17 , pp. 904-911
    • Ford, J.E.1    Aksyuk, V.A.2    Bishop, D.J.3    Walker, J.A.4
  • 6
    • 0035368876 scopus 로고    scopus 로고
    • Linearization of electrostatically actuated surface micromachined 2-D optical scanner
    • June
    • H. Toshiyoshi, W. Piyawattanametha, C.-T. Chan, and M. C. Wu, "Linearization of electrostatically actuated surface micromachined 2-D optical scanner," J. Microelectromech. Syst., vol. 10, pp. 205-214, June 2001.
    • (2001) J. Microelectromech. Syst. , vol.10 , pp. 205-214
    • Toshiyoshi, H.1    Piyawattanametha, W.2    Chan, C.-T.3    Wu, M.C.4
  • 8
    • 20244368635 scopus 로고
    • Trench etch process for a single-wafer RIE dry etch reactor
    • Gmbh; US Patent 4 855 017, Sept. 8
    • R. Bosch Gmbh, "Trench etch process for a single-wafer RIE dry etch reactor," US Patent 4 855 017, Sept. 8, 1988.
    • (1988)
    • Bosch, R.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.