Die-level characterization of silicon-nitride membrane/silicon structures using resonant ultrasonic spectroscopy

Journal of Microelectromechanical Systems

Volumn 12, Issue 1, 2003, Pages 53-63

  Guo, Hang ^a   Lal, Amit ^a  

^a Cornell University   (United States)

Author keywords

Microelectromechanical systems (MEMS); Nondestructive evaluation (NDE); Resonant ultrasound spectroscopy (RUS); Ultrasonic

Indexed keywords

CHEMICAL VAPOR DEPOSITION; ELASTIC MODULI; FINITE ELEMENT METHOD; INVERSE PROBLEMS; MATHEMATICAL MODELS; NATURAL FREQUENCIES; NONDESTRUCTIVE EXAMINATION; SILICON NITRIDE; SPECTROSCOPY; SUBSTRATES; THIN FILMS; ULTRASONICS;

LOAD DEFLECTION METHOD; LOW PRESSURE CHEMICAL VAPOR DEPOSITION; RESONANT ULTRASOUND SPECTROSCOPY; SILICON SUBSTRATE;

MICROELECTROMECHANICAL DEVICES;

EID: 0037302394     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2002.807477     Document Type: Article

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