Potential thermo-mechanical substrate damage in nanoparticle removal with pulsed lasers

Journal of Adhesion Science and Technology

Volumn 17, Issue 1, 2003, Pages 91-113

  Lin, Jiadao ^a   Cetinkaya, Cetin ^a  

^a CLARKSON UNIVERSITY   (United States)

Author keywords

Laser cleaning; Laser ultrasonics; Micro manufacturing; Nano manufacturing; Nanoparticles; Particle removal; Thermo mechanical damage

Indexed keywords

COPPER; LASER PULSES; SEMICONDUCTOR DEVICES; SILICON; SUBSTRATES; THERMAL LOAD; THERMOMECHANICAL TREATMENT; ULTRASONICS; ACCELERATION; CLEANING; MANUFACTURE; NANOPARTICLES; PARTICLE SIZE; PULSED LASERS;

LASER CLEANING;

NANOSTRUCTURED MATERIALS; SUBSTRATES;

LASER CLEANING; MICRO-MANUFACTURING; NANO-MANUFACTURING; PARTICLE REMOVAL; THERMO-MECHANICAL;

EID: 0037284713     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/15685610360472466     Document Type: Article

References (26)

1. International Technology Roadmap for Semiconductors (Lithography Roadmap-2000 Update, http://public.itrs.net/Files/2000UpdateFinal/2kUdFinal.htm) (2000).
2. H. Li, Ph.D. Thesis, Clarkson University, Potsdam, NY (2001).
3. W. Zapka, W. Ziemlich and A. C. Tam, Appl. Phys. Lett. 58, 2217 (1991).
4. A. C. Tam, W. P. Leung, W. Zapka and W. Ziemlich, J. Appl. Phys. 71, 3515-3523 (1992).
5. X. Wu, Ph.D. Thesis, Universite de Montreal, Montreal, Quebec, Canada (1999).
6. D. R. Halfpenny and D. M. Kane, J. Appl. Phys. 86, 6641-6646 (1999).
7. A. A. Kolomenski, H. A. Schuessler, V. G. Mikhaleich and A. A. Maznev, J. Appl. Phys. 84, 2404-2410 (1998).
8. Y. F. Lu, Y. W. Zheng and W. D. Song, J. Appl. Phys. 87, 1534-1539 (2000).
9. Y. F. Lu, Y. W. Zheng and W. D. Song, Appl. Phys. A 68, 569-572 (1999).
10. C. Cetinkaya, J. Wu and C. Li, J. Non-Destruct. Eval. 20, 49-60 (2001).
11. C. Cetinkaya, C. Li and J. Wu, J. Sound Vibration 231, 195-217 (2000).
12. C. Cetinkaya, R. Vanderwood and M. Rowell, J. Adhesion Sci. Technol. 16, 1201-1214 (2002).
13. C. Cetinkaya, J. Lin, R.Vanderwood and C. Li, J. Adhesion Sci. Technol., in press (2002).
14. Y. C. Zhou, Z. P. Duan and Q. B. Yang, Int. J. Solids Structures 36, 363-389 (1999).
15. B. S. Lukyanchuk, Y. W. Zheng and Y. F. Lu, Proc. SPIE 4065, 576-588 (2000).
16. M. Mosbacher, H. J. Münzer, J. Zimmermann, J. Solis, J. Boneberg and P. Leiderer, Appl. Phys. A 72, 41-44 (2001).
17. A. F. Banishev and E. A. Balykina, Quantum Electronics 27, 542-544 (1997).
18. C. Dutto, E. Fogarassy and D. Mathiot, Appl. Surface Sci. 184 (1-4), 362-366 (2001).
19. A. D. Zweig, V. Venugopalan and T. F. Deutsch, J. Appl. Phys. 74, 4181-4189 (1993).
20. Xin-Zen Li, M. Nakano, Y. Yamauchi, K. Kishida and K. A. Tanaka, J. Appl. Phys. 83, 3583-3594 (1998).
21. M. A. Meyers, Dynamic Behavior of Materials. John Wiley & Sons, New York (1994).
22. K. L. Johnson, K. Kendall and A. D. Roberts, Proc. Royal. Soc. A 324, 301-313 (1971).
23. M. Soltani and G. Ahmadi, J. Adhesion 44, 161-175 (1994).
24. M. Soltani and G. Ahmadi, J. Adhesion Sci. Technol. 8, 763-785 (1994).
25. ABAQUS, Version 6.2, Theory Manual. Hibbitt, Karlsson & Sorensen, Inc., Pawtucket, RI (2001).
26. M. Reichling, A. Bodemann and N. Kaiser, Thin Solid Films 320, 264-279 (1998).