Modeling and simulation of spiral inductors in Wafer Level Packaged RF/wireless chips

Analog Integrated Circuits and Signal Processing

Volumn 34, Issue 1, 2003, Pages 39-47

  Duo, Xinzhong ^a   Zheng, Li Rong ^a   Tenhunen, Hannu ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; COMPUTER SIMULATION; ELECTRIC INDUCTORS; ELECTRONICS PACKAGING; EQUIVALENT CIRCUITS; ESTIMATION; FINITE ELEMENT METHOD; PERFORMANCE; THREE DIMENSIONAL;

QUALITY FACTOR; RADIO FREQUENCY INTEGRATED CIRCUITS; SELF-RESONANCE FREQUENCY; SOFTWARE PACKAGE SPICE; SPIRAL INDUCTORS; WAFER LEVEL PACKAGED CHIPS;

DIGITAL INTEGRATED CIRCUITS;

EID: 0037272419     PISSN: 09251030     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1020334300576     Document Type: Article

References (10)

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