Nucleation and growth of electroless palladium deposition on polycrystalline TiN barrier films for electroless copper deposition

Journal of the Electrochemical Society

Volumn 150, Issue 1, 2003, Pages

  Hong, Seok Woo ^a   Lee, Yong Sun ^a   Park, Ki Chul ^b   Park, Jong Wan ^a  

^a Hanyang University   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL MICROSTRUCTURE; ELECTROLESS PLATING; GRAIN BOUNDARIES; GROWTH (MATERIALS); MAGNETRON SPUTTERING; NUCLEATION; PALLADIUM; POLYCRYSTALLINE MATERIALS; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; TITANIUM NITRIDE; TRANSMISSION ELECTRON MICROSCOPY;

ELECTROLESS COPPER DEPOSITION; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; GRAIN REFINEMENT;

COPPER;

EID: 0037255373     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1523413     Document Type: Article

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