Obtainable microstructures in electrical conductors made of a copper-silver alloy

IEEE Transactions on Magnetics

Volumn 39, Issue 1, 2003, Pages 323-326

  Castro Dettmer, Zachira ^a   Simmons, Martha ^a   Persad, Chadee ^a  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

Cu Ag alloys; High conductivity; High strength; Metal matrix composite; Microstructure

Indexed keywords

CASTING; COPPER ALLOYS; ELECTRIC CONDUCTIVITY; ELECTRIC CONDUCTORS; ELECTRIC DISCHARGES; HARDNESS; INGOTS; MECHANICAL VARIABLES MEASUREMENT; MELTING; MICROSTRUCTURE; YIELD STRESS;

CAST BILLETS; COPPER SILVER ALLOYS; HARDNESS MEASUREMENT;

ELECTROMAGNETIC LAUNCHERS;

EID: 0037225422     PISSN: 00189464     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMAG.2002.806372     Document Type: Article

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