Preparation and properties of TiB2 nanoparticle reinforced copper matrix composites by in situ processing

Materials Letters

Volumn 52, Issue 6, 2002, Pages 448-452

  Tu, J P ^a   Wang, N Y ^a   Yang, Y Z ^a   Qi, W X ^a   Liu, F ^b   Zhang, X B ^b   Lu, H M ^b   Liu, M S ^a  

^a ZHEJIANG UNIVERSITY   (China)

^b ZHEJIANG UNIVERSITY   (China)

Author keywords

Copper matrix composites; In situ reaction; TiB2 nanoparticle

Indexed keywords

COPPER; ELECTRIC CONDUCTIVITY; HARDNESS; MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; PARTICLE SIZE ANALYSIS; STIFFNESS; TENSILE STRENGTH; TITANIUM COMPOUNDS;

COPPER MATRIX COMPOSITES;

METALLIC MATRIX COMPOSITES;

EID: 0036466895     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-577X(01)00442-6     Document Type: Article

References (17)