The contribution of thermoreflectance to high resolution thermal mapping

Sensor Review

Volumn 23, Issue 1, 2003, Pages 35-39

  Filloy, C ^a   Tessier, G ^b   Hole S ^a   Jerosolimski, G ^a   Fournier, D ^a  

^a SORBONNE UNIVERSITÉ   (France)

^b PSL RESEARCH UNIVERSITY   (France)

Author keywords

Integrated circuits; Non destructive testing; Thermal testing

Indexed keywords

ELECTRONIC EQUIPMENT; INTEGRATED CIRCUIT TESTING; LIGHT EMITTING DIODES; LIGHTING; SEMICONDUCTOR LASERS; SIGNAL TO NOISE RATIO; THERMAL EFFECTS;

THERMAL MAPPING; THERMOREFLECTANCE;

PHOTODETECTORS;

EID: 0037221187     PISSN: 02602288     EISSN: None     Source Type: Journal    
DOI: 10.1108/02602280310457929     Document Type: Article

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