The interfacial and diffusion properties of copper on polyimide deposited by ionized cluster beam

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 37, Issue 3 SUPPL. B, 1998, Pages 1150-1155

  Kim, Nam Young ^b   Yoon, Hyuong Seek ^a   Lee, Youn Seung ^a   Lim, Kwan Yong ^a   Kim, Ki Won ^c   Whang, Chung Nam ^a  

^a Yonsei University   (South Korea)

^b Soongsil University   (South Korea)

^c SunMoon University   (South Korea)

Author keywords

Copper; Diffusion; Interface; Interlevel dielectric (ILD); Ionized cluster beam deposition (ICBD); Polyimide (PI)

Indexed keywords

EID: 0012202268     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.37.1150     Document Type: Article

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