Selective Wafer Bonding by Surface Roughness Control

Journal of the Electrochemical Society

Volumn 148, Issue 4, 2001, Pages

  Gui, C ^a,b,c   Oosterbroek, R E ^a   Berenschot, J W ^a   Schlautmann, S ^a   Lammerink, T S J ^a   Van Den Berg, A ^a   Elwenspoek, M C ^a  

^a UNIVERSITY OF TWENTE   (Netherlands)

^b ASML   (Netherlands)

^c ELECTROCHEMICAL SOCIETY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0012293668     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1357184     Document Type: Article

References (7)

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3. C. Gui, H. Albers, J. G. K. Gardenias, M. Elwenspoek, and P. V. Lambeck, in Proceedings of Microsystems Technical Conference '96, pp. 205-210. Potsdam, Germany, Sept 17-19, 1996.
4. D. Maugis, J. Adhes. Sci. Technol. 10, 161 (1996).
5. C. Gui, M. Elwenspoek, N. Tas, and J. G. E. Gardeniers, J. Appl. Phys., 85, 7448 (1999).
6. R. E. Oosterbroek, Ph.D. Thesis, University of Twente, Enschede. The Netherlands (1999).
7. T. S. J. Lammerink, N. Olij, J. W. Berenschol, R. B. Oosterbrook, J. G. E. Gardeniers, C. Neagu, A. van den Berg, M. Haller, G. J. M. Krijnen, and M. Elwenspoek, in Proceedings of 6th International Conference on New Actuators, Actuator '98, pp. 122-125, Bremen, Germany, June 17-19, 1998.