Misalignment tolerance analysis of free-space optical interconnects via statistical methods

Applied Optics

Volumn 41, Issue 14, 2002, Pages 2686-2694

  Ozkan, Nur S F ^a   Hendrick, W Lee ^a   Marchand, Philippe J ^a   Esener, Sadik C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0037052118     PISSN: 1559128X     EISSN: 21553165     Source Type: Journal    
DOI: 10.1364/AO.41.002686     Document Type: Article

References (31)

1. M. R. Feldman, S. C. Esener, C. C. Guest, and S. H. Lee, “Comparison between electrical and free-space optical interconnects based on power and speed considerations,” Appl. Opt. 27, 1742-1751 (1988).
2. M. R. Feldman, C. C. Guest, T. J. Drabik, and S. C. Esener, “Comparison between electrical and free-space optical interconnects for fine grain processor arrays based on connection density capabilities,” Appl. Opt. 28, 3820-3829 (1989).
3. F. Kiamilev, P. Marchand, A. Krishnamoorthy, S. Esener, and S. H. Lee, “Performance comparison between optoelectronic and VLSI multistage interconnection networks.” J. Lightwave Technol. 9, 1674-1692 (1991).
4. A. V. Krishnamoorthy, P. Marchand, F. Kiamilev, K. S. Urquhart, S. Esener, “Grain-size consideration for optoelectronic multistage interconnection network,” Appl. Opt., 31, 5480-5507 (1992).
5. S. Patra, J. Ma, V. Ozguz, and S. H. Lee, “Alignment issues in packaging for free-space optical interconnects,” Optical Engineering, May 1994, Vol.33, No.5, 1561
6. D. Zaleta, S. Patra, V. Ozguz, J. Ma, and S. H. Lee, “Toleranc-ing of board-level-free-space optical interconnects,” Appl. Opt. 35, 1317-1327 1996.
7. stcentury: a technology roadmap,” IEEE JST in Quant. El. 2, 55-76 (1996).
8. V. N. Morozov, L. Yung-Cheng, J. A. Neff, D. O’Brien, T. S. McLaren, and H. Zhou, “Tolerance analysis for threedimensional optoelectronic systems packaging,” Optical Engineering 35, 2034-2044 (1996).
9. D. A. B. Miller, “Physical reasons for optical interconnection,” Intl. J. Optoelectronics. 11, 155-168 (1997).
10. G. Yayla, P. Marchand, and S. Esener, “Speed and energy analysis of digital interconnections: Comparison of on-chip, off-chip, and free-space technologies, Appl. Opt. 37, 205-227 (1998).
11. M. A. Neifeld and R. K. Kostuk, “Error correction for free-space optical interconnects: space-time resource optimization,” Appl. Opt. 37, 296-307 (1998).
12. W. L. Hendrick, N. S. F. Ozkan, P. J. Marchand, and S. C. Esener, “A Monte Carlo simulation for tolerancing microbeam free-space optical interconnects,” in Optics in Computing, of 1999 OSA Technical Digest Series (Optical Society of America, Washington, D.C., 1999), pp. 133-135.
13. X. Zheng, P. J. Marchand, D. Huang, O. Kibar, N. S. F. Ozkan, and S. C. Esener, “Optomechanical design and characterization of a printed-circuit-board-based free-space optical interconnect package,” Appl. Opt. 38, 5631-5640 (1999).
14. V. Baukens, G. Verschaffelt, P. Tuteleers, P. Vynck, H. Otte-vaere, M. Kufner, S. Kufner, I. Veretennicoff, R. Bockstaele, A. Van Hove, B. Dhoedt, R. Baets, and H. Thienpont, “Performances of Optical Multi-Chip-Module Interconnects: Comparing Guided-Wave and Free-Space Pathways,” Pure Appl. Opt. 1, 255-261 (1999).
15. W. L. Hendrick, “Design, fabrication, and packaging of free space optical interconnects,” Ph.D. dissertation, (University of California, San Diego, Calif., 2000)
16. M. Naruse and M. Ishikawa, “Analysis and characterization of alignment for free-space optical interconnects based on singular-value decomposition,” Appl. Opt. 39, 293-301 (2000).
17. F. Lacroix, M. Chateauneuf, X. Xue, and A. G. Kirk, “Experimental and numerical analyses of misalignment tolerances in free-space optical interconnects,” Appl. Opt. 39, 704 -713 (2000).
18. F. Lacroix and A. G. Kirk, “Tolerance stackup effects in freespace optical interconnects,” Appl. Opt. 40, 29, 5240-5247 (2001).
19. B. R. Frieden, Probability, Statistical Optics, and Data Testing, 3rd ed., (Springer, New York, 2001).
20. Ron C. Mittelhammer, Mathematical Statistics for Economics and Business (Springer, New York, 1996).
21. J. Neter, M. H. Kutner, C. J. Nachtsheim, and W. Wasserman, Applied Linear Statistical Models (Mc Graw-Hill, New York, 1996).
22. R. L. Mason, R. F. Gunst, and J. L. Hess, Statistical Design and Analysis of Experiments (John Wiley and Sons, New York, 1989).
23. L. L. Lapin, Quantitative Methods for Business Decisions (Harcourt Brace Jovanovich, Inc., San Diego, Calif., 1981).
24. G. E. P. Box, W. G. Hunter, J. S. Hunter, Statistics for Experimenters (John Wiley and Sons, New York, 1978).
25. R. H. Myers, Response Surface Methodology (Allyn and Bacon, Inc., Boston, 1971).
26. W. Mendenhall, Introduction to Linear Models and the Design and Analysis of Experiments (Wadsworth Publishing Co., Belmont, Calif., 1968).
27. N. R. Draper and H. Smith, Applied Regression Analysis (John Wiley and Sons, Inc. New York, 1966).
28. D. R. Cox, Planning of Experiments (John Wiley and Sons, New York, 1966).
29. O. L. Davies, ed., The Design and Analysis of Industrial Experiments (Hafner Publishing Co., New York, 1963).
30. M. Sasieni, A. Yaspan, L. Freidmen, Operations Research: Methods and Problems (John Wiley and Sons, Inc., New York, 1959).
31. W. G. Cochran, and G. M. Cox, Experimental Designs (John Wiley and Sons, New York, 1957).