Stress diagnostics in multicrystalline silicon wafers using an acoustic technique

Conference Record of the IEEE Photovoltaic Specialists Conference

Volumn , Issue , 2002, Pages 332-335

  Belyaev, A ^a   Lulu, S ^a   Tarasov, I ^a   Ostapenko, S ^a   Kalejs, J P ^b  

^a UNIVERSITY OF SOUTH FLORIDA   (United States)

^b ASE Americas Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

POLARISCOPES; RAMAN SPECTROSCOPY; RESIDUAL STRESSES; SOLAR CELLS; STRESS ANALYSIS; TRANSMISSION ELECTRON MICROSCOPY; ULTRASONIC TESTING; X RAY DIFFRACTION ANALYSIS;

ACOUSTIC TECHNIQUE; MULTICRYSTALLINE SILICON WAFERS; STRESS DIAGNOSTICS;

SILICON WAFERS;

EID: 0036953492     PISSN: 01608371     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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2. S. Ostapenko, I. Tarasov, J. P. Kalejs, C. Haessler, E.-U. Reisner, "Defect Monitoring Using Scanning Photoluminescence Spectroscopy in mc-Si Wafers", Semicond. Sci. Technol. 15, 2000, pp. 840-848.
3. Y. Gogotsi, C. Baek, F. Kirscht, "Raman Microspectroscopy Study of Processing-induced Phase Transformations and Residual Stress in Silicon" Semiconductor Science and Technology, 14, 1999, pp. 936-944.
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7. X. Y. Ye, et. al. "Determination of the Mechanical Properties of Microstructures", Sensors and Actuators, A54, 1996, pp. 750-754.