Vacuum and cryogenic station for microelectromechanical systems probing and testing

Review of Scientific Instruments

Volumn 73, Issue 12, 2002, Pages 4393-4395

  Legrand, B ^a   Quevy E ^a   Stefanelli, B ^a   Collard, D ^a,b   Buchaillot, L ^a  

^a INSTITUT D ELECTRONIQUE   (France)

^b INSTITUTE OF INDUSTRIAL SCIENCE   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; ENERGY DISSIPATION; INTEGRATED CIRCUITS; LOW TEMPERATURE PHENOMENA; NATURAL FREQUENCIES; POWER AMPLIFIERS; RESONATORS; VACUUM;

FREQUENCY SHIFT;

MICROELECTROMECHANICAL DEVICES;

EID: 0036933422     PISSN: 00346748     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1518140     Document Type: Article

References (8)

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2. C. H. Mastrangelo, Tribol. Lett. 3, 223 (1997).
3. V. Agache, E. Quévy, D. Collard, and L. Buchaillot, Appl. Phys. Lett. 79, 3869 (2001).
4. C. T.-C. Nguyen and R. T. Howe, Tech. Dig. - Int. Electron Devices Meet. 199 (1993).
5. C. T.-C. Nguyen and R. T. Howe, Tech. Dig. - Int. Electron Devices Meet. 505 (1992).
6. Varian Vacuum Technology, Lexington, MA, www.vvp.varian.com
7. Lake Shore, Westerville, OH www.lakeshore.com
8. KarlSuss, Munich, Germany, www.suss.com