Mechanical properties of boron doped Si and Si/SiO2 membranes

Materials Research Society Symposium - Proceedings

Volumn 729, Issue , 2002, Pages 119-124

  Kuhn, Gabe ^a   Myers, Todd ^a   Bose, Susmita ^a   Bandyopadhyay, Amit ^a  

^a Washington State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BORON; DOPING (ADDITIVES); ETCHING; MECHANICAL TESTING; MICROMACHINING; PHOTOLITHOGRAPHY; REACTIVE ION ETCHING; RESIDUAL STRESSES; SILICA; STIFFNESS; TENSILE STRESS;

BUFFERED OXIDE ETCHANT; NANO MECHANICAL TESTING;

MICROELECTROMECHANICAL DEVICES;

EID: 0036924340     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-729-u3.12     Document Type: Conference Paper

References (11)

1. H. Leplan, B. Geenen, J. Y. Robic, and Y. Pauleau, J. Appl. Phys. 78 (2), 962 (1995).
2. J. Y. Robic, H. Leplan, Y. Pauleau, and B. Rafin, Thin Solid Films. 290-291, 34 (1996).
3. B. Bhushan, S. P. Murarka, and J. Gerlach, J. Vac. Sci. Technol. B. 8 (5), 1068 (1990).
4. I. Blech, and U. Cohen, J. Appl. Phys.53 (6), 4202 (1982).
5. R. J. Jaccodine and W. A. Schlegel, J. Appl. Phys. 37 (6), 2429 (1966).
6. R. Schellin, G. Hess, W. Kuhnel, C. Thielemann, D. Trost, J. Wacker, and R. Steinmann, Sensors and Actuators A. 41-42, 287 (1994).
7. P. Temple-Boyer, E. Scheid, G. Faugere, and B. Rousset, Thin Solid Films. 310, 234 (1997).
8. T. Yi and C. J. Kim, Meas Sci. Technol. 10, 706 (1999).
9. S. K. Ghandhi, VLSI Fabrication Principles, Silicon and Gallium Arsenide, 2nd Ed. John Wiley & Sons, Inc. 1994, pp. 19.
10. R. J. Roark, and W. C. Young, Formulas for Stress and Strain, 5th Ed. McGraw-Hill Book Company. 1975, pp. 96-153.
11. M. Barsoum, Fundamentals of Ceramics, McGraw-Hill Companies, Inc. 1997, pp. 402.