Effects of wire running speed and work feed rate on multiwire saw slicing - Study on 400mm-diameter silicon ingot slicing (2nd report)

Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering

Volumn 67, Issue 5, 2001, Pages 791-796

  Oishi, Hiroshi ^a   Asakawa, Keiichiro ^a   Tsukamoto, Kazushige ^a   Uno, Yoshiyuki ^a  

^a NONE

Author keywords

400mm diameter silicon ingot; Multiwire saw slicing; Slurry layer thickness; Wire running speed; Work feed rate

Indexed keywords

EID: 0012166405     PISSN: 09120289     EISSN: None     Source Type: Journal    
DOI: 10.2493/jjspe.67.791     Document Type: Article

References (6)

1. H. Oishi, K. Asakawa and J. Matsuzaki : Design concept of multiwire saw for 400mm-diameter silicon slicing, Proc. 1998 ASPE Spring Topical Meeting, (1998) 109.
2. M. Fujisawa et al. : Precision sawing with wire, Ann. CIRP, 32 (1983) 87.
3. H. Oishi, K Asakawa and J. Matsuzaki : Qualities of 400mm-diameter as-sliced wafers and quality changes through wafer shaping process, Precision science and technology for perfect surfaces, JSPE, Tokyo, (1999) 393.