Manufacturing the Ti/Cu/Electroless Nickel bump on Si

International Journal of Microcircuits and Electronic Packaging

Volumn 22, Issue 1, 1999, Pages 1-5

  Lin, Kwang Lung ^a   Chen, Jun Wen ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER PLATING; ELECTRIC POTENTIAL; ELECTROLESS PLATING; FRACTURE; INTERFACES (MATERIALS); NICKEL PLATING; SPUTTER DEPOSITION; TITANIUM PLATING;

UNDER BUMP METALLURGY;

SILICON WAFERS;

EID: 0032623822     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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