Molecular dynamics simulation of defect formation during energetic Cu deposition

Thin Solid Films

Volumn 419, Issue 1-2, 2002, Pages 18-26

  Gilmore, Charles M ^a,b   Sprague, James A ^a  

^a NAVAL RESEARCH LABORATORY   (United States)

^b George Washington University ^*  (United States)

Author keywords

Cu deposition; Cu Cu potential; Molecular dynamics simulation

Indexed keywords

ATOMS; COMPRESSIVE STRESS; COPPER; DEPOSITION; EPITAXIAL GROWTH; MOLECULAR DYNAMICS; POINT DEFECTS; POTENTIAL ENERGY; STRAIN; SUBSTRATES; TENSILE STRESS;

INTERSTITIAL CLUSTERS;

FILM GROWTH;

EID: 0036849828     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(02)00609-0     Document Type: Article

References (34)

1. Smidt F.A. Int. Mat. Rev. 35:1990;61.
2. G.K. Hubler, in D.C. Jacobson, D.E. Luzzi, T.F. Heinz, M. Iwaki (Eds.), Beam Solid Interactions for Materials Synthesis and Characterization, MRS Symp. Proc. 354, (1995) 45.
3. Gilmore C.M., Sprague J.A. Phys. Rev. B. 44:1991;8950.
4. Zhang Q.Y., Tang J.Y., Zhao G.Q. Nucl. Inst. Meth. B. 135:1998;289.
5. Gilmore C.M., Sprague J.A. J. Vac. Sci. Technol. A. 10:1992;1597.
6. Sprague J.A., Gilmore C.M. Thin Solid Films. 272:1996;244.
7. Gibson J.B., Goland A.N., Milgram M., Vineyard G.H. Phys. Rev. 120:1960;1229.
8. Robbemond A., Thijsse B.J. Nucl. Inst. Meth. B. 127/128:1997;273.
9. Marks N.A., McKenzie D.R., Pailthorpe B.A. Phys. Rev. B. 53:1996;4117.
10. Marton D., Boyd K.J., Lytle T., Rabalais J.W. Phys. Rev. B. 48:1993;6757.
11. Schneider M., Rahman A., Schuller I.K. Phys. Rev. Lett. 55:1985;604.
12. Daw M.S., Baskes M.I. Phys. Rev. B. 29:1984;6443.
13. Haftel M., Andreadis T.D., Lill J.V., Eridon J.M. Phys. Rev. B. 42:1990;11540.
14. Foiles S.M., Baskes M.I., Daw M.S. Phys. Rev. B. 33:1986;7983.
15. Wilson W.D., Haggmark L.G., Biersack J.P. Phys. Rev. B. 15:1977;2458.
16. Abraham F.F. Adv. Phys. 35:1986;22.
17. Caro A., Victoria M. Phys. Rev. A. 40:1989;2287.
18. Pronnecke S., Caro A., Victoria M., Diaz de la Rubia T., Guinan M.W. J. Mater. Res. 6:1991;483.
19. J.A. Sprague, private communication.
20. Schilling W., Schroeder K., Wollenberger H. Phys. Stat. Solids. 38:1970;245.
21. Gilmore C.M., Sprague J.A. Nanostru. Mater. 9:1997;643.
22. Marton D., Boyd K.J., Rabalais J.W. J. Vac. Sci. Technol. A. 16:1998;1321.
23. Davis C.A. Thin Solid Films. 226:1993;30.
24. Zhou X.W., Wadley H.N.G. J. Appl. Phys. 87:2000;2273.
25. Foreman A.J.E., English C.A., Phythian W.J. Phil. Mag. A. 66:1992;655.
26. Shimomura Y., Nishiguchi R., Diaz de La Rubia T., Guinan M.W. Rad. Eff. Def. Solids. 130/131:1994;483.
27. Zhao P., Shimomura Y. Jpn. J. Appl. Phys. 36:1997;7291.
28. Johnson R.A., Brown E. Phys. Rev. 127:1962;446.
29. Harrison D.E. Rad. Eff. 70:1983;1.
30. Zhou X.W., Wadley H.N.G. Surf. Sci. 431:1999;58.
31. Ziegler J.F., Biersack J.P., Littmark U. The Stopping and Range of Ions in Solids. 1985;Elsevier Science, New York.
32. Hayward W.H., Wolter A.R. J. Appl. Phys. 40:1969;2911.
33. Sprague J.A., Malmberg P.R., Lambert J.M., Treado P.A., Reynolds G.W., Mueller G.P., Rosen M., Vincenz A. Nucl. Instrum. Meth. Phys. Res. B19/20:1987;75.
34. Mueller G.P., Rosen M., Fraser W.A., Sprague J.A., Malmberg P.R., Lambert J.M., Treado P.A., Reynolds G.W. Nucl. Instrum. Meth. Phys. Res. B18:1987;360.