Interface reaction between Ag-Pd conductor and Pd-Sn solder

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 21, Issue 4, 1998, Pages 394-397

  Moriya, Yoichi ^a   Yamade, Yoshiaki ^a   Shinya, Ryuji ^a  

^a Sumitomo Metal Industries Limited   (Japan)

Author keywords

Aging; Intermetallic; Solder joint; Surface mount technology

Indexed keywords

AGING OF MATERIALS; CONDUCTIVE MATERIALS; ENERGY DISPERSIVE SPECTROSCOPY; INTERFACES (MATERIALS); INTERMETALLICS; METALLOGRAPHIC MICROSTRUCTURE; MICROANALYSIS; SCANNING ELECTRON MICROSCOPY; SEGREGATION (METALLOGRAPHY); SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY;

ELECTRON PROBE MICROANALYSIS (EPMA);

ELECTRONICS PACKAGING;

EID: 0032202586     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.730423     Document Type: Article

References (12)

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