Development and application of an abrasive-free polishing solution for copper

MRS Bulletin

Volumn 27, Issue 10, 2002, Pages

  Hanazono, Masanobu ^a   Amanokura, Jin ^a   Kamigata, Yasuo ^a  

^a Showa Denko Materials Co   (Japan)

Author keywords

Abrasive free polishing; Chemical reactivity; Chemical mechanical planarization; Chemical mechanical polishing; CMP; Electronic materials; Semiconductor materials

Indexed keywords

ABRASIVES; ELECTROCHEMISTRY; EROSION; FABRICATION; MULTILAYERS; OPTIMIZATION; SEMICONDUCTOR MATERIALS;

ABRASIVE-FREE POLISHING (AFP);

CHEMICAL MECHANICAL POLISHING;

EID: 0036802215     PISSN: 08837694     EISSN: None     Source Type: Journal    
DOI: 10.1557/mrs2002.248     Document Type: Article

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