Self-constrained LTCC tape

American Ceramic Society Bulletin

Volumn 81, Issue 10, 2002, Pages 27-32

  Lautzenhiser, Frans ^a   Amaya, Edmar ^a  

^a Heraeus Circuit Materials Division   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; CERAMIC MATERIALS; DIELECTRIC PROPERTIES; FITS AND TOLERANCES; LAMINATES; LOW TEMPERATURE PHENOMENA; SHRINKAGE; SINTERING; THICK FILMS;

LOW-TEMPERATURE COFIRED CERAMIC (LTCC) TAPES;

ELECTRIC TAPES;

EID: 0036773540     PISSN: 00027812     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (5)

1. M. Barker and R. Draudt, "Zero Shrink Process for Cost-Sensitive High-Volume LTCC Applications"; pp. 26-31 in Proceedings of the 2001 International Symposium on Microelectronics (IMAPS) (Oct. 9-11, 2001).
2. A.A. Mohamed, "Feasibility Study to Evaluate LTCC for High-Power RF Applications," Ultra RF Inc., 2002, to be published.
3. A. Fathy et al., "Design of Embedded Passive Components in LTCC-M Technology," IEEE Trans. Microwave Theory Tech., MTT, 1281-84 (1998).
4. W. Wersing et al., "Integrated Passive Components Using LTCC," Siemens AG, to be published.
5. S. Horowitz and D. Amey, "Ceramics Meet Next-Generation Fiber-Optic Packaging Requirements," Photon. Spectra, [Nov.] 123-26 (2001).