Zero shrink process for cost sensitive high volume LTCC applications

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4587, Issue , 2001, Pages 26-31

  Barker, Mike ^a   Draudt, Rick ^a  

^a DUPONT COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONSUMER ELECTRONICS; COSTS; SHRINKAGE; SINTERING; SUBSTRATES;

LOW TEMPERATURE CO-FIRED CERAMICS (LTCC);

CERAMIC MATERIALS;

EID: 0035773395     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. H.T. Sawhill, R.H. Jensen, K.R. Mikeska, "Dimensional Control in Low Temperature Co-fired Ceramic Multilayers," Ceramic Transactions, 15 611-628 (1990).
2. K.R. Mikeska, R.H. Jensen, "Pressure Assisted Sintering of Multilayer Packages," Ceramic Transactions, 15 629-650 (1990).
3. th International SAMPE Electronics Conference June 22-25 1992.
4. K.R. Mikeska, D.T. Schaefer, R.H.Jensen, "Method for Reducing Shrinkage During Firing of Green Ceramic Bodies," U.S. Pat. No. 5,085,720 issued Feb. 4, 1992.
5. K.R. Mikeska, D.T. Schaefer, "Method for Reducing Shrinkage During Firing of Ceramic Bodies," U.S. Pat. No. 5,254,191 issued Oct. 19, 1993.
6. K.R. Mikeska, D.T. Schaefer, "Green Ceramic Composite and Method for Making Such Composite," U.S. Pat. No. 5,387,474 issued Feb. 7, 1995.
7. K.R. Mikeska, D.T. Schaefer, "Method for Reducing Shrinkage During Firing of Ceramic Bodies," U.S. Pat. No. 5,474,741 issued Dec. 12, 1995.