Ceramics meet next-generation fiber optic packaging requirements

Photonics Spectra

Volumn 35, Issue 11, 2001, Pages 123-126

  Horowitz, Samuel J ^a   Amey, Daniel I ^a  

^a Thick film Materials Business Unit   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HERMETIC PACKAGING;

BANDWIDTH; COST EFFECTIVENESS; ELECTRONICS PACKAGING; FIBER OPTIC NETWORKS; OPTICAL COMMUNICATION; TELECOMMUNICATION TRAFFIC; THICK FILMS;

CERAMIC MATERIALS;

EID: 0035525870     PISSN: 07311230     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (0)