Microthrusters in silicon for aerospace application

IEEE Aerospace and Electronic Systems Magazine

Volumn 17, Issue 9, 2002, Pages 22-27

  Lamedica, Giulio ^a   Balucani, Marco ^a   Ferrari, Aldo ^a   Tromboni Pier, Domenico ^a   Marchetti, Mario ^a  

^a SAPIENZA UNIVERSITY OF ROME   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

AEROSPACE APPLICATIONS; CODES (SYMBOLS); COMPUTER SIMULATION; FINITE ELEMENT METHOD; MICROELECTROMECHANICAL DEVICES; SATELLITES; SILICON WAFERS;

MICROTHRUSTERS;

AIRCRAFT PROPULSION;

EID: 0036760641     PISSN: 08858985     EISSN: None     Source Type: Journal    
DOI: 10.1109/MAES.2002.1039790     Document Type: Review

References (10)

1. thAIAA/USU Small Satellite Conference, North Logan, UT.
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3. thAnnual/USU Conference on Small Satellites.
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5. C. Rossi, M.D. Rouhani and D. Esteve, 5 November 1999, Prediction of the performance of a Si-micromachined microthruster by computing the subsonic gas flow inside the thruster.
6. M. Shikida, K. Sato and D. Uchikawa, (2000), Differences in anisotropic etching properties of KOH and TMAH solutions, Sensor and Actuators 80, 179-188.
7. A. Ploéul and G. Kraéuter, 12 October 1998, Wafer direct bonding: tailoring adhesion between brittle materials, Max Planck Institute fu er Mikrostrukturphysik. Weinberg 2, D-06120, Halle (Saale), Germany.
8. I. Zubel and I. Barycka, (1998), Silicon anisotropic etching in alkaline soultions 1. The geometric description of figures developed under etching Si (100) in various solutions, Sernsor and Actuators A 70, 250-259.
9. Graded final thesis dissertation, P.D. Tromboni, 13 July 2001, Studio di sistemi innovative per la stabilizzazione di piattaforme spaziali, Chapter 3, pp.45-49, Rome.
10. A. Ploéul and G. Kraéuter, October 1998, Max-Planck-Institute fu Er Mikrostrukturphysic, Wafer direct bonding: tailoring adhesion between brittle materials, Weinberg 2, D-06120, Halle (Saale), Germany, Accepted October 12, 1998.