Process development of precision surface micro-machining using mechanical abrasion and chemical etching

Microsystem Technologies

Volumn 8, Issue 6, 2002, Pages 419-426

  Lee, J M ^a   Sung, I H ^a   Kim, D E ^a  

^a Yonsei University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASION; ETCHING; METAL CUTTING; MOLDS;

CHEMICAL ETCHING;

MICROMACHINING;

EID: 0036749854     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-002-0193-7     Document Type: Article

References (21)

1. Bhushan B. (1999) Principles and Applications of Tribology. John Wiley, New York, pp. 479-519.
2. Challen J.M. Oxley P.L.B. (1979) An explanation of the different regimes of friction and wear using asperity deformation models. Wear 53: 229-243.
3. Hamilton G.M.; Goodman L.E. (1966) The stress field created by a circular sliding contact. J Appl Mech-T ASME 33: 371-375.
4. Johnson K.L. (1985) Contact Mechanics. Cambridge University Press, New York, pp. 84-104, 153-157.
5. Kato K. (1997) Wear Mechanisms. In: Hutchings I.M. (ed.) New Directions in Tribology - Plenary and Invited Papers from the 1st World Tribology Congress, Mechanical Engineering Publication, England, pp. 39-56.
6. Kim D.E.; Jin W.H. (2000) Machining method of thin coated layer for micro-patterning on silicon wafer. Korea patent 283-338.
7. Kim D.E.; Suh N.P. (1991) On microscopic mechanisms of friction and wear. Wear 149: 199-208.
8. Kim D.E. Suh N.P. (1993) Plastic deformation of silicon during contact sliding at ambient temperature. J Mater Sci 28: 3895-3899.
9. Kim D.E.; Yi J.J. (1998) Micro-patterning of silicon by frictional interaction and chemical reaction. J Tribol-T ASME 120: 353-357.
10. Kitsunai H.; Kato K.; Hokkirigawa K.; Inoue H. (1990) The transitions between microscopic wear modes during repeated sliding friction observed by a scanning electron microscope tribosystem. Wear 135: 237-249.
11. Lee J.M.; Jin W.H.; Kim D.E. (2001) Application of single asperity abrasion process for surface micro-machining. Wear 251: 1133-1143.
12. Lucca D.A.; Rhorer R.L.; Komanduri R. (1991) Energy dissipation in the ultraprecision machining of copper. Annals of CIRP 40: 69-72.
13. Menz W. (1996) LIGA and related technologies for industrial application. Sensor Actuat A-Phys 54: 785-789.
14. Miu D.K.; Tai Y. (1995) Silicon micromachined SCALED technology. IEEE T Ind Electron 42: 234-239.
15. O'Sullivan T.C.; King R.B. (1988) Sliding contact stress field due to a spherical indenter on a layered elastic half surface. J Tribol-T ASME 110: 235-240.
16. Petersen K.E. (1982) Silicon as a mechanical material. P IEEE 70: 420-457.
17. Qin D.; Xia Y.; Rogers J.A.; Jackman R.J.; Zhao X.M.; Whitesides G.M. (1998) Microfabrication, microstructures and microsystems. Top Curr Chem 194: 1-20.
18. Rogner A.; Eicher J.; Munchmeyer D.; Peters R.P.; Mohr J. (1992) The LIGA Technique - what are the new opportunities. J Micromech Microeng 2: 133-140.
19. Romankiw L.T. (1997) A path: from electroplating through lithographic masks in electronics to LIGA in MEMS. Electrochim Acta 42: 2985-3005.
20. Shimada S.; Ikawa N.; Tanaka H.; Uchikoshi J. (1994) Structure of micromachined surface simulated by molecular dynamics analysis. Annals of CIRP 43: 51-54.
21. Suh N.P. (1986) Tribophysics. Prentice-Hall, New Jersey, pp. 128-171.