Phase formation and reaction kinetics in M-In systems (M = Pt, Pd, Mn)

Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques

Volumn 93, Issue 9, 2002, Pages 885-893

  Studnitzky, Thomas ^a   Schmid Fetzer, Rainer ^a  

^a Institute of Metallurgy   (Germany)

Author keywords

Diffusion soldering; Interface kinetics; Interface reactions; Metal In systems; Transient liquid phase bonding

Indexed keywords

BINARY ALLOYS; DIFFUSION IN SOLIDS; MANGANESE ALLOYS; PALLADIUM ALLOYS; PHASE EQUILIBRIA; PHASE INTERFACES; PLATINUM ALLOYS; REACTION KINETICS; REMELTING; SOLDERING; TEMPERATURE; X RAY DIFFRACTION ANALYSIS;

DIFFUSION SOLDERING; INTERFACE KINETICS; INTERFACE REACTIONS; METAL INDIUM SYSTEMS; TRANSIENT LIQUID PHASE BONDING;

PHASE TRANSITIONS;

EID: 0036742321     PISSN: 00443093     EISSN: None     Source Type: Journal    
DOI: 10.3139/146.020885     Document Type: Article

References (32)

1. Zwicker, U.: Z. Metallkd. 41 (1950) 399.
2. Aoyagi, K.; Sugihara, M.: J. Phys. Soc. Japan 17 (1962) 1072.
3. Kopp, W.U.; Romer, O.; Wachtel, E.: Z. Metallkd. 59 (1968) 917.
4. Jain, K.C.; Bhan, S.: Trans. Indian Inst. Met. 25 (1972) 100.
5. Guex, P.; Feschotte, P.: J. Less-Common. Metals 46 (1976) 101.
6. Browne, J.D.; Hance, N.J.; Johnston, G.B.; Sampson, C.F.: Phys. Stat. Sol. 49 (1978) 177.
7. Allen, L.H.; Hung, L.S.; Kavanagh, K.L.; Phillips, J.R.; Yu, A.J.; Mayer, J.W.: Appl. Phys. Lett. 51 (1987) 326.
8. Jandova, J.; Jakes, D.: Kovove Mat. 26 (1988) 38.
9. Schmid, E.E.; Carle, V.: Prakt. Met. 25 (1988) 340.
10. Sands, T.; Marshall, E.D.; Wang, L.C.: J. Mater. Res. 3 (1988) 914.
11. Massalski, T.B. et al. (eds.): Binary Alloy Phase Diagrams, ASM, Materials Park, OH (1990).
12. Stremsdoerfer, G.; Martin, J.R.; Clechet, P.; Nguyen-Du: J. Electrochem. Soc. 137 (1990) 256.
13. Villars, P.; Calvert, L.D.: Pearson's Handbook of Crystallographic Data for Intermetallic Phases, ASM, Material Park, OH (1991).
14. Lin, C.F.; Mohney, S.E.; Chang, Y.A.: J. Appl. Phys. 74 (1993) 4398.
15. Swenson, D.; Chang, Y.A.: Mat. Sci. Eng. B 22 (1994) 267.
16. Fu, H.G.; Huang, T.S.: Sol.-State Electr. 38 (1995) 89.
17. Kraus, W.; Nolze, G.: J. Appl. Cryst. 29 (1996) 301.
18. Häusermann, U.; Elding-Pontén, M.; Svensson, Ch.; Lidin, S.: Chem. Eur. J. 4 (1998) 1007.
19. Kim, H.S.; Lee, K.H.; Shin, M.C.; Kim, S.Y.; Dzo, M.H.: Scripta Mater. 38 (1998) 1549.
20. Kuper, Ch.; Peng, W.; Pisch, A.; Goesmann, F.; Schmid-Fetzer, R.: Z. Metallkd. 89 (1998) 855.
21. Kraus, W.; Nolze, G.: PowderCell for Windows Version 2.3, Federal Institute for Materials Research and Testing, Berlin (1999).
22. Wong, W.S.; Wengrow, A.B.; Cho, Y.; Salleo, A.; Quitoriano, N.J.; Cheung, N.W.; Sands, T.: J. Electr. Mat. 28 (1999) 1409.
23. Kim, H.S.; Dzo, M.H.; Lee, K.H.; Shin, M.C.: J. Mat. Sci. 35 (2000) 4989.
24. Wong, W.S.; Sands, T.; Cheung, N.W. Kneissl, M.; Bour, D.P.; Mei, P.; Romano, L.T.; Johnson, N.M.: Appl. Phys. Lett. 77 (2000) 2822.
25. Guo, F.; Lee, J.; Choi, S.; Lucas, J.P.; Bieler, T.R.; Subramanian, K.N.: J. Electr. Mat. 30 (2001) 1073.
26. Quitoriano, N.; Wong, W.S.; Tsakalakos, L.; Cho, Y.; Sands, T.: J. Electr. Mat. 30 (2001) 1471.
27. Wong, W.S.; Kneissl, M.; Treat, D.W.; Teepe, M.; Miyashita, N.; Johnson, N.M.: Mat. Res. Soc. Symp. Proc. 681 E (2001) I6.1.1-I.6.1.9.
28. Lee, J.G.; Guo, F.; Subramanian, K.N.; Lucas, J.P.: Soldering and Surface Mount Technology (in press).
29. Studnitzky, T.; Onderka, B.; Schmid-Fetzer, R.: Z. Metallkd. 93 (2002) 48.
30. Studnitzky, T.; Schmid-Fetzer, R.: 93 (2002) 894 to Z. Metallkd.
31. Studnitzky, T.; Schmid-Fetzer, R.: J. Electron. Mat., in press.
32. ICDD Powder Diffraction File, International Center for Diffraction Data, Newtown Square, PA 19073-3273 (1998).