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Volumn 25, Issue 3, 2002, Pages 365-373

Thermal and electroless deposition of copper on poly(tetrafluoroet hylene-co-hexafluoropropylene) films modified by surface graft copolymerization

Author keywords

Adhesion strength; Electroless plating; Evaporated copper; FEP; Surface grafting

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPPER; ELECTROLESS PLATING; GRAFT COPOLYMERS; X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 0036706329     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2002.805316     Document Type: Conference Paper
Times cited : (6)

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