Solder paste with polymerizing flux for lead-free solder alloy

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4587, Issue , 2001, Pages 535-540

  Nishina, Tsutomu ^a   Okamoto, Kenji ^a  

^a FUJI ELECTRIC CO   (Japan)

Author keywords

Epoxy resin; Lead free; Solder paste; Soldering flux; VOC free; Wettability

Indexed keywords

ADHESION; EPOXY RESINS; EUTECTICS; IONS; MOLDING; POLYMERIZATION; PRINTED CIRCUIT BOARDS; SOLVENTS;

SOLDERING FLUXES;

SOLDERING ALLOYS;

EID: 0035768412     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. th European Microelectronic and Packaging Conference, IMAPS Europ, pp.98-104, 1999.
2. A.F. Schneider, "VOC-Free Fluxes", Circuits Assembly, pp.41-43, 1993.
3. Kenji Okamoto, Takahiko Maeda, Kohji Haga, "Copper Ion Migration in Insulated Metal Substrates", EEIC and EMCW, Chicago, USA, pp. 659-663, 1995.
4. Hiep Diep-Quang, "VOC-Free no Clean Solder Paste", the International Conference on Electric Assembly, 1996.