Advances in epoxy molding compounds

Technical Papers, Regional Technical Conference - Society of Plastics Engineers

Volumn , Issue , 1992, Pages 68-82

  Rauhut, H W ^a  

^a Dexter Electronic Materials ^*

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING--STRESSES; ENCAPSULATION--ANALYSIS; STRESSES--ANALYSIS; THERMOSETS--MOLDING;

EPOXY MOLDING COMPOUNDS; MICROELECTRONIC GRADE EPOXIES;

EPOXY RESINS;

EID: 0026732408     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)