Apparent coefficient of thermal expansion and residual stresses in multilayer capacitors

Composites Part A: Applied Science and Manufacturing

Volumn 33, Issue 8, 2002, Pages 1115-1121

  Hsueh, Chun Hway ^a   Ferber, Mattison K ^a  

^a OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

A. Laminates; B. Residual internal stress; B. Thermomechanical; C. Analytical modelling

Indexed keywords

CERAMIC CAPACITORS; CERAMIC MATERIALS; DIELECTRIC MATERIALS; ELECTRODES; MULTILAYERS; PLASTICITY; RESIDUAL STRESSES; SANDWICH STRUCTURES; THERMAL EXPANSION;

MULTILAYER CAPACITORS (MLC);

LAMINATED COMPOSITES;

EID: 0036671652     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-835X(02)00054-4     Document Type: Article

References (13)

1. Review of mechanical related failures of ceramic capacitors and capacitor materials
2. Ceramic and glass-ceramic packaging in the 1990s
3. Silver-palladium thick-film conductors
4. Thermal expansion mismatch in electronic packaging
5. Electrode-based causes of delamination in multilayer ceramic capacitors
6. Cracking of surface mount capacitors: Crack susceptibility by vickers indentation techniques
7. Multilayer capacitor margin stresses and electrode to dielectric thickness calculations
8. Structural integrity of ceramic multilayer capacitor materials and ceramic multilayer capacitors
9. Residual stresses in metal/ceramic bonded strips
10. Coefficients of thermal expansion of some laminated ceramic composites
11. Finite-element analysis of ceramic multilayer capacitors: Failure probability caused by wave soldering and bending loads