Multilayer capacitor margin stresses and electrode to dielectric thickness calculations

Ferroelectrics, Letters Section

Volumn 21, Issue 1-2, 1996, Pages 1-9

  Carlson, William ^a   Rutt, Truman ^b   Wild, Michael ^a  

^a New York State College of Ceramics at Alfred University   (United States)

^b AVX CORPORATION   (United States)

Author keywords

Capacitors; Multilayers; Residual stresses; Thermal elastic stresses

Indexed keywords

CALCULATIONS; CERAMIC MATERIALS; COOLING; DIELECTRIC PROPERTIES; ELASTIC MODULI; ELECTRODES; MATHEMATICAL MODELS; MULTILAYERS; RESIDUAL STRESSES; STRENGTH OF MATERIALS; THERMAL EXPANSION; THERMAL STRESS;

CERAMIC MARGIN; COMPRESSIVE STRESS; DIELECTRIC THICKNESS; TEMPERATURE DIFFERENCE; THERMAL ELASTIC STRESS; THERMAL EXPANSION COEFFICIENT;

CAPACITORS;

EID: 0029724209     PISSN: 07315171     EISSN: None     Source Type: Journal    
DOI: 10.1080/07315179608204737     Document Type: Article

References (6)

1. S.W. Freiman, R.C Pohanka, J. Am. Ceram. Soc., 72[12] 2258-63 1989
2. D. Johnson-Walls, M.D. Drory, A.G. Evans, J. Am. Ceram. Soc., 68[7] 363-7 1985
3. N. Fujikawa, M. Inagaki, N. Yokoe, Ceram. Trans., [8] 292-302 1990
4. B.S. Rawal, K. Krishnamani, J. Maxwell, Ceram. Trans., [15] 329-45 1990
5. O. Kimura, J. of Japan Soc. of Powder and Powder Metallurgy, 41[6] 690-694 1994
6. O. Kimura, T. Kawashima, J. Am. Ceram. Soc., 76[3] 757-9 1993