Interface structure and formation mechanism of diffusion-bonded SiC/TiAl joint

Journal of Materials Science Letters

Volumn 18, Issue 13, 1999, Pages 1011-1012

  Liu, Huijie ^a   Feng, Jicai ^a   Qian, Yiyu ^a   Li, Zhuoran ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFACES (MATERIALS); MICROANALYSIS; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; SILICON CARBIDE; SURFACE STRUCTURE; TITANIUM ALLOYS; X RAY DIFFRACTION ANALYSIS;

DIFFUSION-BONDING; TITANIUM ALUMINIDE;

CERAMIC MATERIALS;

EID: 0032638118     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1006626132693     Document Type: Article

References (5)

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3. J. C. FENG, H. J. LIU and Z. R. LI, Trans. Chin. Weld. Inst. 2 (1997) 20.
4. T. FUKAI, M. NAKA and J. C. SCHUSTER, Trans. JWRI 1 (1996) 59.
5. A. E. MARTINELLI and R. A. L. DREW, Mater. Sci. Engng. A 191 (1995) 239.