Analysis of diffusion bond interface of TiAl base alloy with Ti, TC4 alloy and 40Cr steel

Journal of Harbin Institute of Technology (New Series)

Volumn 7, Issue 2, 2000, Pages 78-81

  He, Peng ^a   Feng, Ji Cai ^a   Qian, Yi Yu ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Diffusion bonding; Interface reacting; Ti3Al; TiAl

Indexed keywords

EID: 0003376705     PISSN: 10059113     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (3)

1. SETO Sachio, MATSUMOTO Koji. TiAl intermetallics and strengdi cliaracteristics of diffusion joint of structural steel [J] . Collected Papers of Fusion Welding Society, 1998, 16 (1) : 59-61.
2. NAKAO Yoshikuni, SHINBOZAKI Kenji, HAMADA Masahiko. Diffusion bonding of intermctallic compound TiAl[j]. ISU International, 1991, 10 (31) : 1260-1266.
3. CAM G, BOHM K H, KOCAD M. The fracture behavior of diffusion bonded duplex gamma TiAl[J]. JOM, 1996, 11: 66-68.