Effect of nonlinear elastic behavior on bilayer decohesion of thin metal films from nonmetal substrates

Journal of Applied Mechanics, Transactions ASME

Volumn 69, Issue 4, 2002, Pages 407-414

  Baker, Shefford P ^a   Wang, X ^a   Hui, C Y ^a  

^a School of Operations Research and Industrial Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTICITY; METALLIC FILMS; RESIDUAL STRESSES; STIFFNESS; STRAIN; SUBSTRATES;

STRAIN ENERGY;

THIN FILMS;

EID: 0036660837     PISSN: 00218936     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1468998     Document Type: Article

References (11)

1. Hu, M.S., Thouless, M.D., and Evans, A.G., 1988, "The Decohesion of Thin Films From Brittle Substrates," Acta Metall., 36, pp. 1301-1307.
2. Drory, M.D., Thouless, M.D., and Evans, A.G., 1988, "On the Decohesion of Residually Stressed Thin Films," Acta MetalL, 36, pp. 2019-2028.
3. Suo, Z., and Hutchinson, J.W., 1989, "Steady-State Cracking in Brittle Substrates Beneath Adherent Films," Int. J. Solids Stuct., 25, pp. 1337-1353.
4. Evans, A.G., and Dalgleish, B.J, 1992, "The Fracture Resistance of Metal Ceramic Interfaces," Acta Metall. Mater., 40, pp. S295-S305.
5. Bagchi, A., Lucas, G.E., Suo, Z., and Evans, A.G., 1994, "A New Procedure for Measuring the Decohesion Energy for Thin Ductile Films on Substrates," J. Mater. Res., 9, pp. 1734-1741.
6. Kriese, M.D., Gerberich, W.W, and Moody, N.R., 1999, "Quantitative Adhesion Measures of Multilayer Films: Part II. Indentation of W/Cu, W/W, Cr/W," J. Mater. Res., 14, pp. 3019-3026.
7. Lane, M., and Dauskardt, R.H., 2000, "Adhesion and Reliability of Copper Interconnects With Ta and TaN Barrier Layers," J. Mater. Res., 15, pp. 203-211.
8. Baker, S.P., Keller, R.-M., and Arzt, E., 1998, "Energy Storage and Recovery in Thin Metal Films on Substrates," Proceedings, Thin Films: Stresses and Mechanical Properties VII, R.C. Cammarata et al. eds., Materials Research Society, Warrendale PA, pp. 605-610.
9. Shu, J., Clyburn, S., Mates, T., and Baker, S.P. 1999 "Effects of Thickness Oxygen Content on Thermomechanical Behavior of Thin Cu Gilms Passivated With AlN" Proceedings Materials Reliability in Microelectronics IX, D.D. Brown et al., eds., Materials Research Society Pittsburgh, PA, pp. 707-712.
10. Keller, R.-M., Baker, S.P., and Arzt, E., 1998, "Quantitative Analysis of Strengthening Mechanisms in Thin Cu films: Effects of Film Thickness, Grain Size and Passivation," J. Mater. Res., 13, pp. 1307-1317.
11. Wang, X., 2000, "Bilayer Modeling and Measurements of Adhesion of Copper Thin Films to Glass," M.S. thesis, Cornell University, Ithaca, NY.