Surface modification of Si-containing polymers during etching for bilayer lithography

Microelectronic Engineering

Volumn 61, Issue 62, 2002, Pages 901-906

  Eon, David ^a   De Poucques, L ^b   Peignon, M C ^a   Cardinaud, C ^a   Turban, G ^a   Tserepi, A ^c   Cordoyiannis, G ^c   Valamontes, E S ^d   Raptis, I ^c,d   Gogolides, E ^c  

^a INSTITUT DES MATÉRIAUX JEAN ROUXEL   (France)

^b INSTITUT JEAN LAMOUR   (France)

^c INSTITUTE OF MICROELECTRONICS   (Greece)

^d UNIVERSITY OF WEST ATTICA   (Greece)

Author keywords

Bilayer lithography; Pattern roughness; PDMS; XPS

Indexed keywords

ELLIPSOMETRY; ETCHING; LITHOGRAPHY; MASKS; PLASMA APPLICATIONS; SILICON; SURFACE ROUGHNESS; SURFACE TREATMENT; THICKNESS CONTROL; X RAY PHOTOELECTRON SPECTROSCOPY;

BILAYER LITHOGRAPHY; MICROMASKS; PATTERN ROUGHNESS;

POLYMERS;

EID: 0036643858     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(02)00482-3     Document Type: Article

References (7)