A new masking method for protecting silicon surfaces during anisotropic silicon wet etching

Microelectronic Engineering

Volumn 61-62, Issue , 2002, Pages 895-900

  Normand, P ^a   Beltsios, K ^b,c   Tserepi, A ^a   Aidinis, K ^d   Tsoukalas, D ^a   Cardinaud, C ^e  

^a INSTITUTE OF MICROELECTRONICS   (Greece)

^b INSTITUTE OF NANOSCIENCE AND NANOTECHNOLOGY   (Greece)

^c UNIVERSITY OF IOANNINA   (Greece)

^d UNIVERSITY OF ATHENS   (Greece)

^e INSTITUT DES MATÉRIAUX JEAN ROUXEL   (France)

Author keywords

Fluorocarbon film; Fluorocarbon plasma; Masking; Mesa patterning; Silicon etching; Silicon micromachining

Indexed keywords

ANISOTROPIC SILICON WET ETCHING; SILICON MASKING;

ANISOTROPY; ETCHING; FLUOROCARBONS; INTEGRATED CIRCUITS; MASKS; SILICA; THIN FILMS;

SILICON WAFERS;

EID: 0036643585     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(02)00510-5     Document Type: Article

References (8)