Multilayer interconnects for a high power packaging strategy

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3582, Issue , 1998, Pages 330-334

  Lostetter, A B ^a   Barlow, F ^a   Elshabini, A ^a  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COMPOUNDS; ELECTRONICS PACKAGING; INTERCONNECTION NETWORKS; METALLIC MATRIX COMPOSITES; MULTICHIP MODULES; MULTILAYERS; POWER CONTROL; POWER CONVERTERS; ROUTERS; SUBSTRATES;

MULTILAYER INTERCONNECTS;

POWER ELECTRONICS;

EID: 0032307179     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)