Integrated Power Modules (IPMs), a novel MCM approach to high power electronics design and packaging

International Journal of Microcircuits and Electronic Packaging

Volumn 21, Issue 3, 1998, Pages 274-278

  Lostetter, A B ^a   Barlow, F ^a   Elshabini, A ^a  

^a State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC NETWORK TOPOLOGY; ELECTRIC WIRE; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT LAYOUT; METALLIC MATRIX COMPOSITES; MICROELECTRONICS; POWER CONTROL; POWER CONVERTERS; POWER ELECTRONICS; SURFACE MOUNT TECHNOLOGY; THERMOANALYSIS;

INTEGRATED POWER MODULES (IPM);

MULTICHIP MODULES;

EID: 0032255225     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

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