Characterization of thermopile based on complementary metal-oxide-semiconductor (CMOS) materials and post CMOS micromachining

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 41, Issue 6 B, 2002, Pages 4340-4345

  Du, Chen Hsun ^a   Lee, Chengkuo ^b  

^a QIC Engineering Corp   (Taiwan)

^b NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

CMOS; Front side Si bulk etching; Micromachining; Thermal sensor; Thermopile

Indexed keywords

ABSORPTION; COMPOSITION; ETCHING; HEAT CONDUCTION; HEAT CONVECTION; MICROMACHINING; MICROSENSORS; POLYSILICON; SCANNING ELECTRON MICROSCOPY; THERMOCOUPLES; THERMOPILES; VACUUM;

THERMAL SENSORS;

CMOS INTEGRATED CIRCUITS;

EID: 0036614620     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.41.4340     Document Type: Article

References (10)