Vibration induced fatigue life estimation of corner leads of peripheral leaded components

Journal of Electronic Packaging, Transactions of the ASME

Volumn 118, Issue 4, 1996, Pages 244-249

  Sidharth, S ^a,b   Barker, D B ^a  

^a UNIVERSITY OF MARYLAND   (United States)

^b ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; INTEGRATED CIRCUITS; LOADS (FORCES); VIBRATIONS (MECHANICAL);

CORNER LEADS; DYNAMIC LOADS; DYNAMIC STRESSES; FATIGUE FAILURE; PERIPHERAL LEADED COMPONENTS;

ELECTRONICS PACKAGING;

EID: 0030407260     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792159     Document Type: Article

References (9)

1. Barker, D. B., and S Sidharth, 1994, “Local PWB and Component Bowing of an Assembly Subjected to a Bending Moment,” ASME Journal of Electronic Packaging, Vol. 116, No. 2, pp. 92-97.
2. Barker, D. B., Chen, Y. S., and Dasgupta, A., 1993, “Estimating the Vibration Fatigue Life of Quad Leaded Surface Mount Components,” ASME Journal of Electronic Packaging, Vol. 115, No. 2, pp. 195-200.
3. Engel, P. A., 1990, “Structural Analysis for Circuit Card Systems Subjected to Bending,” ASME Journal of Electronic Packaging, Vol. 112, No. 1, pp. 2-10.
4. Engel, P. A., Caletka, D. V., and Palmer, M. R., 1991, “Stiffness and Fatigue Study for Surface Mounted Module/Lead/Card Systems,” ASME Journal of Electronic Packaging, Vol. 114, pp. 203-210.
5. Gould, P. L., 1988, Analysis of Shells and Plates, Springer Verlag Inc., NY.
6. Pitarresi, J. M., and Akanda, A., 1993, “Random Vibration Response of a Surface Mount Lead/Solder Joint,” Proceedings of the 1993 ASME International Electronics Packaging Conference, Binghamton, New York.
7. Lau, J. H., 1991, ed., Solder Joint Reliability-Theory and Applications, Van Nostrand Reinhold, New York.
8. S Sidharth, 1995, “Fatigue Life Estimation of Component Leads Subject to PWB Vibration,” Ph.D. Dissertation, Mechanical Engineering, University of Maryland, College Park.
9. Steinberg, D. S., 1988, Vibration Analysis for Electronic Equipment, 2nd ed., John Wiley & Sons, New York.