-
1
-
-
0029774940
-
Microwave inductors and capacitors in standard multilevel interconnect silicon technology
-
Jan.
-
J.N. Burghartz, M. Soyuer, and K.A. Jenkins, "Microwave inductors and capacitors in standard multilevel interconnect silicon technology," IEEE Trans. Microwave Theory Tech., vol. 44, pp. 100-104, Jan. 1996.
-
(1996)
IEEE Trans. Microwave Theory Tech.
, vol.44
, pp. 100-104
-
-
Burghartz, J.N.1
Soyuer, M.2
Jenkins, K.A.3
-
2
-
-
0033356218
-
A new fabrication method for high-Q on-chip spiral inductor
-
H. Jiang, J.A. Yeh, and N.C. Tien, "A new fabrication method for high-Q on-chip spiral inductor," Proc. SPIE, vol. 3876, pp. 153-159, 1999.
-
(1999)
Proc. SPIE
, vol.3876
, pp. 153-159
-
-
Jiang, H.1
Yeh, J.A.2
Tien, N.C.3
-
3
-
-
0032595840
-
Surface micromachined solenoid on-Si and on-glass inductors for RF applications
-
Sept.
-
J.-B. Yoon, B.-K. Kim, C.-H. Han, E. Yoon, and C.-K. Kim, "Surface micromachined solenoid on-Si and on-glass inductors for RF applications," IEEE Electron Device Lett., vol. 20, pp. 487-489, Sept. 1999.
-
(1999)
IEEE Electron Device Lett.
, vol.20
, pp. 487-489
-
-
Yoon, J.-B.1
Kim, B.-K.2
Han, C.-H.3
Yoon, E.4
Kim, C.-K.5
-
4
-
-
0032276250
-
Progress in RF inductors on silicon-understanding substrate losses
-
J.N. Burghartz, "Progress in RF inductors on silicon-Understanding substrate losses," in IEDM Tech. Dig., 1998, pp. 523-526.
-
(1998)
IEDM Tech. Dig.
, pp. 523-526
-
-
Burghartz, J.N.1
-
6
-
-
0033280207
-
High Q inductors in a SiGe BiCMOS process utilizing a thick metal process add-on module
-
R. Groves, J. Malinowski, R. Volant, and D. Jadus, "High Q inductors in a SiGe BiCMOS process utilizing a thick metal process add-on module," in Proc. IEEE BCTM Conf., 1999, pp. 149-152.
-
(1999)
Proc. IEEE BCTM Conf.
, pp. 149-152
-
-
Groves, R.1
Malinowski, J.2
Volant, R.3
Jadus, D.4
-
7
-
-
0033365516
-
High-performance three dimensional on-chip inductors fabricated by novel micromachining technology for RF MMIC
-
June
-
J.-B. Yoon, C.-H. Han, E. Yoon, and C.-K. Kim, "High-performance three dimensional on-chip inductors fabricated by novel micromachining technology for RF MMIC," in IEEE MTT-S Int. Microwave Symp. Dig., June 1999, pp. 1523-1526.
-
(1999)
IEEE MTT-S Int. Microwave Symp. Dig.
, pp. 1523-1526
-
-
Yoon, J.-B.1
Han, C.-H.2
Yoon, E.3
Kim, C.-K.4
-
8
-
-
0002732640
-
A 0.35 μm SiGe BiCMOS process featuring a 80 GHz f max HBT and integrated high-Q RF passive components
-
S. Decoutere, F. Vleugels, R. Kuhn, R. Loo, M. Caymax, S. Jenei, J. Croon, S. Van Huylenbroeck, M. Da Rold, E. Rosseel, P. Chevalier, and P. Coppens, "A 0.35 μm SiGe BiCMOS process featuring a 80 GHz f max HBT and integrated high-Q RF passive components," in Proc. 2000 BIPOLAR/BiCMOS Circuits Technol. Meeting, 2000, pp. 106-109.
-
(2000)
Proc. 2000 BIPOLAR/BiCMOS Circuits Technol. Meeting
, pp. 106-109
-
-
Decoutere, S.1
Vleugels, F.2
Kuhn, R.3
Loo, R.4
Caymax, M.5
Jenei, S.6
Croon, J.7
Van Huylenbroeck, S.8
Da Rold, M.9
Rosseel, E.10
Chevalier, P.11
Coppens, P.12
-
9
-
-
0034428326
-
Electromagneticall y shielded high-Q CMOS compatible copper inductors
-
San Francisco, CA, Feb 7-9
-
H. Jiang, J.A. Yeh, Y. Wang, and N.C. Tien, "Electromagnetically shielded high-Q CMOS compatible copper inductors," in Dig. Tech. Papers Int. Solid-State Circuits Conf. (ISSCC'00), San Francisco, CA, Feb 7-9, 2000, pp. 814-815.
-
(2000)
Dig. Tech. Papers Int. Solid-State Circuits Conf. (ISSCC'00)
, pp. 814-815
-
-
Jiang, H.1
Yeh, J.A.2
Wang, Y.3
Tien, N.C.4
-
10
-
-
0033709718
-
Fabrication of high-performance on-chip suspended spiral inductors by micromachining and electroless copper plating
-
Boston, MA, June 11-16
-
H. Jiang, Y. Wang, J.A. Yeh, and N.C. Tien, "Fabrication of high-performance on-chip suspended spiral inductors by micromachining and electroless copper plating," in Int. Microwave Symp. Dig., Boston, MA, June 11-16, 2000, pp. 279-282.
-
(2000)
Int. Microwave Symp. Dig.
, pp. 279-282
-
-
Jiang, H.1
Wang, Y.2
Yeh, J.A.3
Tien, N.C.4
-
11
-
-
4243288203
-
-
Tech. Rep., White Plains, NY. [Online]
-
J.M. Shaw, J.D. Gelorme, N.C. LaBianca, W.E. Conley, and S.J. Holmes. (2002) Negative photoresists for optical lithography. Tech. Rep., IBM, White Plains, NY. [Online]. Available: http://www.research.ibm.com/journal/rd/411/shaw.html.
-
(2002)
Negative photoresists for optical lithography
-
-
Shaw, J.M.1
Gelorme, J.D.2
Labianca, N.C.3
Conley, W.E.4
Holmes, S.J.5
-
12
-
-
0033693546
-
Membrane supported Ka band resonator employing organic micromachined packaging
-
J.E. Harriss, L.W. Pearson, X. Wang, C.H. Barron, and A. Pham, "Membrane supported Ka band resonator employing organic micromachined packaging," in IEEE MTT-S Dig., vol. 2, 2000, pp. 1225-1228.
-
(2000)
IEEE MTT-S Dig.
, vol.2
, pp. 1225-1228
-
-
Harriss, J.E.1
Pearson, L.W.2
Wang, X.3
Barron, C.H.4
Pham, A.5
-
14
-
-
0011811128
-
Development of an organic micromachining process on silicon for RF/Microwave applications
-
Baltimore, MD
-
D. Newlin, A. Pham, J. Harriss, and J.B. Lee, "Development of an organic micromachining process on silicon for RF/Microwave applications," in Proc. 34th Int. Symp. Microelectron., Baltimore, MD, 2001.
-
(2001)
Proc. 34th Int. Symp. Microelectron.
-
-
Newlin, D.1
Pham, A.2
Harriss, J.3
Lee, J.B.4
-
15
-
-
0033338539
-
RF/Microwave characterization of multilayer ceramic-based MCM technology
-
Aug.
-
A. Sutono, A.H. Pham, J. Laskar, and W.R. Smith, "RF/Microwave characterization of multilayer ceramic-based MCM technology," IEEE Trans. Adv. Packag., vol. 22, pp. 326-331, Aug. 1999.
-
(1999)
IEEE Trans. Adv. Packag.
, vol.22
, pp. 326-331
-
-
Sutono, A.1
Pham, A.H.2
Laskar, J.3
Smith, W.R.4
-
16
-
-
0011881828
-
-
Mimotec. Tech. Rep., Brighton, MA. [Online]. Available: HYPERLINK
-
Mimotec. (2002). Tech. Rep., Brighton, MA. [Online]. Available: HYPERLINK http://aveclafaux.freeservers.com/SU-8.html.
-
(2002)
-
-
|