Multichip MMIC package for X and K a bands

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 20, Issue 1, 1997, Pages 27-33

  Decker, D Richard ^a,b   Olson, Hilding M ^a,b   Tatikola, Ramani ^a,b   Gutierrez, Ray ^a,c   Mysoor, Narayan Rangappa ^a,d  

^a IEEE   (United States)

^b Lehigh University   (United States)

^c Phoenix Microwave Corporation   (United States)

^d CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Computer modeling; IC packaging; Microwave measurements; Monolithic microwave integrated circuit (MMIC)

Indexed keywords

COMPUTER SIMULATION; ELECTRIC CONDUCTORS; ELECTRIC WIRE; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT TESTING; MICROWAVE MEASUREMENT; MULTICHIP MODULES; PROBES; WAVEGUIDES;

CHIP BYPASS CAPACITOR; MILLIMETER WAVE SEMICONDUCTOR DEVICE; MULTICHIP MONOLITHIC MICROWAVE INTEGRATED CIRCUIT PACKAGE;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0031076128     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.554520     Document Type: Article

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